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Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329

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Reference TypeJournal (article/letter/editorial)
TitleEstimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index
JournalMATERIALS TRANSACTIONS
AuthorsShohji, IkuoAuthor
Yasuda, KiyokazuAuthor
Takemoto, TadashiAuthor
Year2005Volume46
Issue11
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2329Search in ResearchGate
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Mindat Ref. ID7777836Long-form Identifiermindat:1:5:7777836:5
GUID0
Full ReferenceShohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Plain TextShohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
In(2005) MATERIALS TRANSACTIONS Vol. 46 (11) Japan Institute of Metals

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Yasuda, Kiyokazu, Shohji, Ikuo, Takemoto, Tadashi (2008) Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index. Materials Science Forum, 580. 221-224 doi:10.4028/www.scientific.net/msf.580-582.221
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu (2005) Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders. MATERIALS TRANSACTIONS, 46 (11). 2335-2343 doi:10.2320/matertrans.46.2335
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394
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Wang, Ying-Hui, Howlader, Matiar R, Nishida, Kenji, Kimura, Takashi, Suga, Tadatomo (2005) Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder. MATERIALS TRANSACTIONS, 46 (11). 2431-2436 doi:10.2320/matertrans.46.2431
Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki (2005) Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints. MATERIALS TRANSACTIONS, 46 (11). 2316-2321 doi:10.2320/matertrans.46.2316
Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa (2005) Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen. MATERIALS TRANSACTIONS, 46 (11). 2309-2315 doi:10.2320/matertrans.46.2309
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Men, Hua, Zhang, Tao (2005) Glass Formation and Thermal Stability of Bulk Glassy Cu–Zr–Ti–Sn–Si Alloys. MATERIALS TRANSACTIONS, 46 (7). 1692-1694 doi:10.2320/matertrans.46.1692
Zhang, Xiaorui, Matsuura, Hiroyuki, Tsukihashi, Fumitaka, Yuan, Zhangfu (2012) Wettability of Sn–Zn, Sn–Ag–Cu and Sn–Bi–Cu Alloys on Copper Substrates. MATERIALS TRANSACTIONS, 53 (5). 926-931 doi:10.2320/matertrans.m2011349
 
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