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Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu (2005) Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders. MATERIALS TRANSACTIONS, 46 (11). 2335-2343 doi:10.2320/matertrans.46.2335

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Reference TypeJournal (article/letter/editorial)
TitleFatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders
JournalMATERIALS TRANSACTIONS
AuthorsTakahashi, TakehikoAuthor
Hioki, SusumuAuthor
Shohji, IkuoAuthor
Kamiya, OsamuAuthor
Year2005Volume46
Issue11
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.46.2335Search in ResearchGate
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Mindat Ref. ID7777837Long-form Identifiermindat:1:5:7777837:4
GUID0
Full ReferenceTakahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu (2005) Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders. MATERIALS TRANSACTIONS, 46 (11). 2335-2343 doi:10.2320/matertrans.46.2335
Plain TextTakahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu (2005) Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders. MATERIALS TRANSACTIONS, 46 (11). 2335-2343 doi:10.2320/matertrans.46.2335
In(2005) MATERIALS TRANSACTIONS Vol. 46 (11) Japan Institute of Metals

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Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu (2006) An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation. Key Engineering Materials, 326. 1035-1038 doi:10.4028/www.scientific.net/kem.326-328.1035
Shohji, Ikuo, Yoshida, Tomohiro, Takahashi, Takehiko, Hioki, Susumu (2002) Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders. MATERIALS TRANSACTIONS, 43 (8). 1854-1857 doi:10.2320/matertrans.43.1854
Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu (2006) Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder. Key Engineering Materials, 306. 115-120 doi:10.4028/www.scientific.net/kem.306-308.115
Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki (2005) Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints. MATERIALS TRANSACTIONS, 46 (11). 2316-2321 doi:10.2320/matertrans.46.2316
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
Ishikawa, Shinji, Hashino, Eiji, Kono, Taro, Tatsumi, Kohei (2005) IMC Growth of Solid State Reaction between Ni UBM and Sn–3Ag–0.5Cu and Sn–3.5Ag Solder Bump Using Ball Place Bumping Method during Aging. MATERIALS TRANSACTIONS, 46 (11). 2351-2358 doi:10.2320/matertrans.46.2351
Shohji, Ikuo, Yoshida, Tomohiro, Takahashi, Takehiko, Hioki, Susumu (2004) Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity. Materials Science and Engineering: A, 366. 50-55 doi:10.1016/j.msea.2003.09.057
Hung, Fei-Yi, Chen, Puo-Sheng, Lui, Truan-Sheng, Chen, Li-Hui (2005) Thin Film Characteristics of Sn–3.5Ag–(2.0Cu) Alloy. MATERIALS TRANSACTIONS, 46 (12). 3020-3025 doi:10.2320/matertrans.46.3020
Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa (2005) Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen. MATERIALS TRANSACTIONS, 46 (11). 2309-2315 doi:10.2320/matertrans.46.2309
Men, Hua, Zhang, Tao (2005) A Bulk Glassy Cu–Zr–Ti–Sn Alloy with Superior Plasticity. MATERIALS TRANSACTIONS, 46 (11). 2545-2547 doi:10.2320/matertrans.46.2545
 
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