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Huh, Seok-Hwan, Kim, Keun-Soo, Suganuma, Katsuaki (2002) Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder. MATERIALS TRANSACTIONS, 43 (2). 239-245 doi:10.2320/matertrans.43.239

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
JournalMATERIALS TRANSACTIONS
AuthorsHuh, Seok-HwanAuthor
Kim, Keun-SooAuthor
Suganuma, KatsuakiAuthor
Year2002Volume43
Issue2
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.43.239Search in ResearchGate
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Mindat Ref. ID7776322Long-form Identifiermindat:1:5:7776322:0
GUID0
Full ReferenceHuh, Seok-Hwan, Kim, Keun-Soo, Suganuma, Katsuaki (2002) Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder. MATERIALS TRANSACTIONS, 43 (2). 239-245 doi:10.2320/matertrans.43.239
Plain TextHuh, Seok-Hwan, Kim, Keun-Soo, Suganuma, Katsuaki (2002) Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder. MATERIALS TRANSACTIONS, 43 (2). 239-245 doi:10.2320/matertrans.43.239
In(2002) MATERIALS TRANSACTIONS Vol. 43 (2) Japan Institute of Metals

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Huh, Seok-Hwan, Kim, Keun-Soo, Suganuma, Katsuaki (2001) Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder. MATERIALS TRANSACTIONS, 42 (5). 739-744 doi:10.2320/matertrans.42.739
Suganuma, Katsuaki, Huh, Seok-Hwang, Kim, Keunsoo, Nakase, Hirofumi, Nakamura, Yoshikazu (2001) Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder. MATERIALS TRANSACTIONS, 42 (2). 286-291 doi:10.2320/matertrans.42.286
Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, Hagio, Koichi (2005) Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate. MATERIALS TRANSACTIONS, 46 (11). 2413-2418 doi:10.2320/matertrans.46.2413
Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Inoue, Masahiro, Izuta, Goro (2007) Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder. MATERIALS TRANSACTIONS, 48 (3). 584-593 doi:10.2320/matertrans.48.584
Lee, Jae-Ean, Kim, Keun-Soo, Inoue, Masahiro, Jiang, Junxiang, Suganuma, Katsuaki (2008) Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy. Journal of Alloys and Compounds, 454. 310-320 doi:10.1016/j.jallcom.2006.12.037
Kim, Seong-Jun, Kim, Keun-Soo, Kim, Sun-Sik, Kang, Chung-Yun, Suganuma, Katsuaki (2008) Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application. MATERIALS TRANSACTIONS, 49 (7). 1531-1536 doi:10.2320/matertrans.mf200809
Lee, Kiju, Kim, Keun-Soo, Suganuma, Katsuaki (2011) Influence of indium addition on electromigration behavior of solder joint. Journal of Materials Research, 26 (20) 2624-2631 doi:10.1557/jmr.2011.283
Sakurai, Hitoshi, Kukimoto, Youichi, Kim, Seongjun, Baated, Alongheng, Lee, Kiju, Kim, Keun-Soo, Kumamoto, Seishi, Suganuma, Katsuaki (2010) Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish. MATERIALS TRANSACTIONS, 51 (10). 1727-1734 doi:10.2320/matertrans.mj201001
Yoon, Jeong-Won, Lee, Chang-Bae, Jung, Seung-Boo (2002) Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. MATERIALS TRANSACTIONS, 43 (8). 1821-1826 doi:10.2320/matertrans.43.1821
Kim, Young-Sun, Kim, Keun-Soo, Hwang, Chi-Won, Suganuma, Katsuaki (2003) Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys. Journal of Alloys and Compounds, 352. 237-245 doi:10.1016/s0925-8388(02)01168-4
 
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