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Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni
JournalMATERIALS TRANSACTIONS
AuthorsHwang, Chi-WonAuthor
Suganuma, KatsuakiAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.714Search in ResearchGate
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Mindat Ref. ID7777380Long-form Identifiermindat:1:5:7777380:1
GUID0
Full ReferenceHwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
Plain TextHwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Hwang, Chi-Won, Suganuma, Katsuaki (2004) Joint reliability and high temperature stability of Sn–Ag–Bi lead-free solder with Cu and Sn–Pb/Ni/Cu substrates. Materials Science and Engineering: A, 373. 187-194 doi:10.1016/j.msea.2004.01.019
Huh, Seok-Hwan, Kim, Keun-Soo, Suganuma, Katsuaki (2001) Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder. MATERIALS TRANSACTIONS, 42 (5). 739-744 doi:10.2320/matertrans.42.739
Suganuma, Katsuaki, Huh, Seok-Hwang, Kim, Keunsoo, Nakase, Hirofumi, Nakamura, Yoshikazu (2001) Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder. MATERIALS TRANSACTIONS, 42 (2). 286-291 doi:10.2320/matertrans.42.286
Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, Hagio, Koichi (2005) Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate. MATERIALS TRANSACTIONS, 46 (11). 2413-2418 doi:10.2320/matertrans.46.2413
Huh, Seok-Hwan, Kim, Keun-Soo, Suganuma, Katsuaki (2002) Effect of Au addition on Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder. MATERIALS TRANSACTIONS, 43 (2). 239-245 doi:10.2320/matertrans.43.239
Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Inoue, Masahiro, Izuta, Goro (2007) Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder. MATERIALS TRANSACTIONS, 48 (3). 584-593 doi:10.2320/matertrans.48.584
Hwang, Chi-Won, Suganuma, Katsuaki, Kiso, Masayuki, Hashimoto, Shigeo (2003) Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders. Journal of Materials Research, 18 (11) 2540-2543 doi:10.1557/jmr.2003.0354
Tsai, Ying-Ling, Hwang, Weng-Sing (2004) Pasty Ranges and Latent Heat Release Modes for Sn-9Zn-xAg Lead-free Solder Alloys. MATERIALS TRANSACTIONS, 45 (6). 1949-1957 doi:10.2320/matertrans.45.1949
Mizuguchi, Yukiko, Murakami, Yosuke, Tomiya, Shigetaka, Asai, Tadashi, Kiga, Tomoya, Suganuma, Katsuaki (2012) Effect of Crystal Orientation on Sn Whisker-Free Sn–Ag–Cu Plating. MATERIALS TRANSACTIONS, 53 (12). 2078-2084 doi:10.2320/matertrans.mb201202
Choi, Won Kyoung, Yoon, Seung Wook, Lee, Hyuck Mo (2001) Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate. MATERIALS TRANSACTIONS, 42 (5). 783-789 doi:10.2320/matertrans.42.783
Huang, Chia-Wei, Lin, Kwang-Lung (2004) Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer. MATERIALS TRANSACTIONS, 45 (2). 588-594 doi:10.2320/matertrans.45.588
 
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