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Lim, Jae-Won, Ishikawa, Yukio, Miyake, Kiyoshi, Yamashita, Mutsuo, Isshiki, Minoru (2002) Influence of Substrate Bias Voltage on the Properties of Cu Thin Films by Sputter Type Ion Beam Deposition. MATERIALS TRANSACTIONS, 43 (6). 1403-1408 doi:10.2320/matertrans.43.1403

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Reference TypeJournal (article/letter/editorial)
TitleInfluence of Substrate Bias Voltage on the Properties of Cu Thin Films by Sputter Type Ion Beam Deposition
JournalMATERIALS TRANSACTIONS
AuthorsLim, Jae-WonAuthor
Ishikawa, YukioAuthor
Miyake, KiyoshiAuthor
Yamashita, MutsuoAuthor
Isshiki, MinoruAuthor
Year2002Volume43
Issue6
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.43.1403Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7776537Long-form Identifiermindat:1:5:7776537:0
GUID0
Full ReferenceLim, Jae-Won, Ishikawa, Yukio, Miyake, Kiyoshi, Yamashita, Mutsuo, Isshiki, Minoru (2002) Influence of Substrate Bias Voltage on the Properties of Cu Thin Films by Sputter Type Ion Beam Deposition. MATERIALS TRANSACTIONS, 43 (6). 1403-1408 doi:10.2320/matertrans.43.1403
Plain TextLim, Jae-Won, Ishikawa, Yukio, Miyake, Kiyoshi, Yamashita, Mutsuo, Isshiki, Minoru (2002) Influence of Substrate Bias Voltage on the Properties of Cu Thin Films by Sputter Type Ion Beam Deposition. MATERIALS TRANSACTIONS, 43 (6). 1403-1408 doi:10.2320/matertrans.43.1403
In(2002) MATERIALS TRANSACTIONS Vol. 43 (6) Japan Institute of Metals

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Lim, Jae-Won, Ishikawa, Yukio, Miyake, Kiyoshi, Yamashita, Mutsuo, Isshiki, Minoru (2002) Improvement of Ta Barrier Film Properties in Cu Interconnection by Using a Non-mass Separated Ion Beam Deposition Method. MATERIALS TRANSACTIONS, 43 (3). 478-481 doi:10.2320/matertrans.43.478
Lim, Jae-Won, Mimura, Kouji, Miyake, Kiyoshi, Yamashita, Mutsuo, Isshiki, Minoru (2003) Effect of Substrate Bias Voltage on the Thermal Stability of Cu/Ta/Si Structures Deposited by Ion Beam Deposition. Japanese Journal of Applied Physics, 42. 2780-2785 doi:10.1143/jjap.42.2780
Bae, Joon Woo, Lim, Jae-Won, Mimura, Kouji, Isshiki, Minoru (2006) Influence of Substrate Bias Voltage on the Impurity Concentrations in Hf Films Deposited by Ion Beam Deposition Method. MATERIALS TRANSACTIONS, 47 (2). 279-282 doi:10.2320/matertrans.47.279
Lim, Jae -Won, Isshiki, Minoru (2003) Effect of substrate bias voltage on the texture and microstructure of Cu thin films deposited by ion beam deposition. Metals and Materials International, 9. 201-205 doi:10.1007/bf03027278
Bae, Joon Woo, Lim, Jae-Won, Mimura, Kouji, Uchikoshi, Masahito, Wada, Mitsuhiro, Ikeda, Makoto, Isshiki, Minoru (2009) Influence of substrate bias voltage on properties of Pt thin films deposited by non-mass separated ion beam deposition method. Materials Letters, 63. 2181-2184 doi:10.1016/j.matlet.2009.07.015
Bae, Joon Woo, Lim, Jae-Won, Mimura, Kouji, Isshiki, Minoru (2004) Agglomeration of Copper Thin Film in Cu/Ta/Si Structure. MATERIALS TRANSACTIONS, 45 (3). 877-879 doi:10.2320/matertrans.45.877
Lim, Jae-Won (2008) Effect of Negative Substrate Bias Voltage on the Nucleation and Growth of Cu Films during the Initial Stage of Ion Beam Deposition. Metals and Materials International, 14. 381-384 doi:10.3365/met.mat.2008.06.381
Zhu, Yongfu, Mimura, Kouji, Ishikawa, Yukio, Isshiki, Minoru (2002) Effect of Floating Zone Refining under Reduced Hydrogen Pressure on Copper Purification. MATERIALS TRANSACTIONS, 43 (11). 2802-2807 doi:10.2320/matertrans.43.2802
Lim, Jae-Won, Mimura, Kouji, Isshiki, Minoru (2004) Trace Impurity Analysis in Ta Films Using Glow Discharge Mass Spectrometry: Concentration Change of Impurities by Applying Negative Substrate Bias Voltage. Japanese Journal of Applied Physics, 43 (12) 8267-8272 doi:10.1143/jjap.43.8267
Shima, Yumiko, Ishikawa, Yukio, Nitta, Hiroyuki, Yamazaki, Yoshihiro, Mimura, Kouji, Isshiki, Minoru, Iijima, Yoshiaki (2002) Self-Diffusion along Dislocations in Ultra High Purity Iron. MATERIALS TRANSACTIONS, 43 (2). 173-177 doi:10.2320/matertrans.43.173
Suzuki, Shigeru, Ishikawa, Yukio, Isshiki, Minoru, Waseda, Yoshio (2002) Surface Segregation of Chromium in a Copper-Chromium Alloy and its Effect on Formation of a Native Oxide Layer. MATERIALS TRANSACTIONS, 43 (10). 2523-2526 doi:10.2320/matertrans.43.2523
 
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