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Takemoto, Tadashi, Funaki, Tatsuya (2002) Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting. MATERIALS TRANSACTIONS, 43 (8). 1784-1790 doi:10.2320/matertrans.43.1784

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Reference TypeJournal (article/letter/editorial)
TitleRole of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting
JournalMATERIALS TRANSACTIONS
AuthorsTakemoto, TadashiAuthor
Funaki, TatsuyaAuthor
Year2002Volume43
Issue8
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.43.1784Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7776609Long-form Identifiermindat:1:5:7776609:6
GUID0
Full ReferenceTakemoto, Tadashi, Funaki, Tatsuya (2002) Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting. MATERIALS TRANSACTIONS, 43 (8). 1784-1790 doi:10.2320/matertrans.43.1784
Plain TextTakemoto, Tadashi, Funaki, Tatsuya (2002) Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting. MATERIALS TRANSACTIONS, 43 (8). 1784-1790 doi:10.2320/matertrans.43.1784
In(2002) MATERIALS TRANSACTIONS Vol. 43 (8) Japan Institute of Metals

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Takemoto, Tadashi, Miyazaki, Makoto (2001) Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test. MATERIALS TRANSACTIONS, 42 (5). 745-750 doi:10.2320/matertrans.42.745
Nishikawa, Hiroshi, Takemoto, Tadashi, Kifune, Kouichi, Uetani, Takashi, Sekimori, Norihisa (2004) Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 45 (3). 741-746 doi:10.2320/matertrans.45.741
Shimokawa, Hanae, Soga, Tasao, Serizawa, Koji (2002) Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder. MATERIALS TRANSACTIONS, 43 (8). 1808-1815 doi:10.2320/matertrans.43.1808
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2005) Interfacial Reaction between Sn–Ag–Co Solder and Metals. MATERIALS TRANSACTIONS, 46 (11). 2394-2399 doi:10.2320/matertrans.46.2394
Knott, Sabine, Mikula, Adolf (2002) Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder Material. MATERIALS TRANSACTIONS, 43 (8). 1868-1872 doi:10.2320/matertrans.43.1868
Takemoto, Tadashi (1996) Lead-free Solder and Micro-joining. Materia Japan, 35 (4). 320-325 doi:10.2320/materia.35.320
Ogawa, Naotaka, Miki, Takahiro, Nagasaka, Tetsuya, Hino, Mitsutaka (2002) Activity Measurement of the Constituents in Molten Sn-Mg-Zn Ternary Lead Free Solder Alloys by Mass Spectrometry. MATERIALS TRANSACTIONS, 43 (12). 3227-3233 doi:10.2320/matertrans.43.3227
Nakamori, Takashi, Ikeda, Mayumi, Noguchi, Kunihiro, Shimizu, Isao, Ohno, Yasuhide (2002) Influence of Shear Height on Shear Strength of Tin-Lead Solder Ball Bonding. MATERIALS TRANSACTIONS, 43 (8). 2130-2136 doi:10.2320/matertrans.43.2130
Shohji, Ikuo, Yoshida, Tomohiro, Takahashi, Takehiko, Hioki, Susumu (2002) Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders. MATERIALS TRANSACTIONS, 43 (8). 1854-1857 doi:10.2320/matertrans.43.1854
Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Shohji, Ikuo, Nakamura, Takao, Mori, Fuminari, Fujiuchi, Shinichi (2002) Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints. MATERIALS TRANSACTIONS, 43 (8). 1797-1801 doi:10.2320/matertrans.43.1797
 
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