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Moriyama, Miki, Konishi, Shinya, Tsukimoto, Susumu, Murakami, Masanori (2004) Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films. MATERIALS TRANSACTIONS, 45 (11). 3172-3176 doi:10.2320/matertrans.45.3172

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films
JournalMATERIALS TRANSACTIONS
AuthorsMoriyama, MikiAuthor
Konishi, ShinyaAuthor
Tsukimoto, SusumuAuthor
Murakami, MasanoriAuthor
Year2004Volume45
Issue11
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.3172Search in ResearchGate
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Mindat Ref. ID7777242Long-form Identifiermindat:1:5:7777242:2
GUID0
Full ReferenceMoriyama, Miki, Konishi, Shinya, Tsukimoto, Susumu, Murakami, Masanori (2004) Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films. MATERIALS TRANSACTIONS, 45 (11). 3172-3176 doi:10.2320/matertrans.45.3172
Plain TextMoriyama, Miki, Konishi, Shinya, Tsukimoto, Susumu, Murakami, Masanori (2004) Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films. MATERIALS TRANSACTIONS, 45 (11). 3172-3176 doi:10.2320/matertrans.45.3172
In(2004) MATERIALS TRANSACTIONS Vol. 45 (11) Japan Institute of Metals

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Moriyama, Miki, Matsunaga, Kentaro, Morita, Toshifumi, Tsukimoto, Susumu, Murakami, Masanori (2004) The Effect of Strain Distribution on Abnormal Grain Growth in Cu Thin Films. MATERIALS TRANSACTIONS, 45 (10). 3033-3038 doi:10.2320/matertrans.45.3033
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Murakami, Masanori, Koide, Yasuo, Moriyama, Miki, Tsukimoto, Susumu (2005) Development of Electrode Materials for Semiconductor Devices. Materials Science Forum, 475. 1705-1714 doi:10.4028/www.scientific.net/msf.475-479.1705
Moriyama, Miki, Kunisu, Masahiro, Kiyamu, Atsushi, Ohno, Ryoich, Murakami, Masanori (2005) Microstructural Analysis of CdTe Radiation Detectors with Indium Electrodes. MATERIALS TRANSACTIONS, 46 (9). 1991-1995 doi:10.2320/matertrans.46.1991
Tsukimoto, Susumu, Ito, Kazuhiro, Wang, Zhongchang, Saito, Mitsuhiro, Ikuhara, Yuichi, Murakami, Masanori (2009) Growth and Microstructure of Epitaxial Ti3SiC2 Contact Layers on SiC. MATERIALS TRANSACTIONS, 50 (5). 1071-1075 doi:10.2320/matertrans.mc200831
Tsukimoto, Susumu, Onishi, Takashi, Ito, Kazuhiro, Murakami, Masanori, Konno, Mitsuru, Yaguchi, Toshie, Kamino, Takeo (2006) Self-formation of Thin Barrier Metal Layers in Cu (Ti) Alloy Metallization. Materia Japan, 45 (12). 879 doi:10.2320/materia.45.879
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Hobbs, Anthony, Murakami, Satoshi, Hosoda, Tsotomi, Ohtsuka, Satoshi, Miyajima, Motoshu, Sugatani, Shinji, Nakamura, Tomoji (2002) Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects. MATERIALS TRANSACTIONS, 43 (7). 1629-1632 doi:10.2320/matertrans.43.1629
 
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