Reference Type | Journal (article/letter/editorial) |
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Title | Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates |
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Journal | MATERIALS TRANSACTIONS |
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Authors | Okamoto, Naoki | Author |
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Wang, Feng | Author |
Watanabe, Tohru | Author |
Year | 2004 | Volume | 45 |
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Issue | 12 |
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Publisher | Japan Institute of Metals |
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DOI | doi:10.2320/matertrans.45.3330Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 7777269 | Long-form Identifier | mindat:1:5:7777269:9 |
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GUID | 0 |
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Full Reference | Okamoto, Naoki, Wang, Feng, Watanabe, Tohru (2004) Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates. MATERIALS TRANSACTIONS, 45 (12). 3330-3333 doi:10.2320/matertrans.45.3330 |
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Plain Text | Okamoto, Naoki, Wang, Feng, Watanabe, Tohru (2004) Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates. MATERIALS TRANSACTIONS, 45 (12). 3330-3333 doi:10.2320/matertrans.45.3330 |
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In | (2004) MATERIALS TRANSACTIONS Vol. 45 (12) Japan Institute of Metals |
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