Okamoto, Naoki, Kimura, Takashi, Watanabe, Tohru (2005) The Effect of Catalyst Density for Adhesion of Electroless Deposited Copper Films on Glass Substrate. Journal of the Japan Institute of Metals, 69 (7). 502-508 doi:10.2320/jinstmet.69.502
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | The Effect of Catalyst Density for Adhesion of Electroless Deposited Copper Films on Glass Substrate | ||
Journal | Journal of the Japan Institute of Metals | ||
Authors | Okamoto, Naoki | Author | |
Kimura, Takashi | Author | ||
Watanabe, Tohru | Author | ||
Year | 2005 | Volume | 69 |
Issue | 7 | ||
Publisher | Japan Institute of Metals | ||
DOI | doi:10.2320/jinstmet.69.502Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 7816081 | Long-form Identifier | mindat:1:5:7816081:9 |
GUID | 0 | ||
Full Reference | Okamoto, Naoki, Kimura, Takashi, Watanabe, Tohru (2005) The Effect of Catalyst Density for Adhesion of Electroless Deposited Copper Films on Glass Substrate. Journal of the Japan Institute of Metals, 69 (7). 502-508 doi:10.2320/jinstmet.69.502 | ||
Plain Text | Okamoto, Naoki, Kimura, Takashi, Watanabe, Tohru (2005) The Effect of Catalyst Density for Adhesion of Electroless Deposited Copper Films on Glass Substrate. Journal of the Japan Institute of Metals, 69 (7). 502-508 doi:10.2320/jinstmet.69.502 | ||
In | (2005) Journal of the Japan Institute of Metals Vol. 69 (7) Japan Institute of Metals |
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