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Kim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2004) Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface. MATERIALS TRANSACTIONS, 45 (3). 710-713 doi:10.2320/matertrans.45.710

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Reference TypeJournal (article/letter/editorial)
TitleAbnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface
JournalMATERIALS TRANSACTIONS
AuthorsKim, Jong HoonAuthor
Jeong, Sang WonAuthor
Lee, Hyuck MoAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.710Search in ResearchGate
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Mindat Ref. ID7777379Long-form Identifiermindat:1:5:7777379:5
GUID0
Full ReferenceKim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2004) Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface. MATERIALS TRANSACTIONS, 45 (3). 710-713 doi:10.2320/matertrans.45.710
Plain TextKim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2004) Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface. MATERIALS TRANSACTIONS, 45 (3). 710-713 doi:10.2320/matertrans.45.710
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Choi, Won Kyoung, Kim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2002) Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint. Journal of Materials Research, 17 (1) 43-51 doi:10.1557/jmr.2002.0009
Kim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2002) Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications. MATERIALS TRANSACTIONS, 43 (8). 1873-1878 doi:10.2320/matertrans.43.1873
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2004) IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging. MATERIALS TRANSACTIONS, 45 (3). 727-733 doi:10.2320/matertrans.45.727
Yoon, Seung Wook, Kim, Jong Hoon, Jeong, Sang Won, Lee, Hyuck Mo (2003) Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy. MATERIALS TRANSACTIONS, 44 (2). 290-297 doi:10.2320/matertrans.44.290
Choi, Won Kyoung, Yoon, Seung Wook, Lee, Hyuck Mo (2001) Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate. MATERIALS TRANSACTIONS, 42 (5). 783-789 doi:10.2320/matertrans.42.783
Kim, Sung Soo, Kim, Jong Hoon, Booh, Seong Woon, Kim, Tae-Gyu, Lee, Hyuck Mo (2005) Microstructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM. MATERIALS TRANSACTIONS, 46 (11). 2400-2405 doi:10.2320/matertrans.46.2400
Kim, Tae Yeon, Han, Sang Soo, Lee, Hyuck Mo (2004) Nanomechanical Behavior of β-SiC Nanowire in Tension: Molecular Dynamics Simulations. MATERIALS TRANSACTIONS, 45 (5). 1442-1449 doi:10.2320/matertrans.45.1442
Kim, Hyun You, Lee, Sung Hoon, Kim, Hyoung Gyu, Ryu, Ji Hoon, Lee, Hyuck Mo (2007) Molecular Dynamic Simulation of Coalescence between Silver and Palladium Clusters. MATERIALS TRANSACTIONS, 48 (3). 455-459 doi:10.2320/matertrans.48.455
Han, Sang Soo, Lee, Hyuck Mo (2004) Study on Cap Closure Mechanism of Single-Walled Carbon Nanotubes by Molecular Dynamics. MATERIALS TRANSACTIONS, 45 (5). 1437-1441 doi:10.2320/matertrans.45.1437
Choi, Won Kyoung, Jang, Se-Young, Kim, Jong Hoon, Paik, Kyung-Wook, Lee, Hyuck Mo (2002) Grain Morphology of Intermetallic Compounds at Solder Joints. Journal of Materials Research, 17 (3) 597-599 doi:10.1557/jmr.2002.0084
Yoon, Jeong-Won, Jung, Seung-Boo (2004) Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5Ag solder and electroless Ni–P substrate. Journal of Alloys and Compounds, 376. 105-110 doi:10.1016/j.jallcom.2003.12.029
 
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