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Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Lan, Kung-An (2008) Microstructures and Fusing Electrical Current of Microelectronic Sn-9Zn-(0.25RE) Solders. MATERIALS TRANSACTIONS, 49 (7). 1491-1495 doi:10.2320/matertrans.mf200801

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructures and Fusing Electrical Current of Microelectronic Sn-9Zn-(0.25RE) Solders
JournalMATERIALS TRANSACTIONS
AuthorsHung, Fei-YiAuthor
Lui, Truan-ShengAuthor
Chen, Li-HuiAuthor
Lan, Kung-AnAuthor
Year2008Volume49
Issue7
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.mf200801Search in ResearchGate
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Mindat Ref. ID7779827Long-form Identifiermindat:1:5:7779827:1
GUID0
Full ReferenceHung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Lan, Kung-An (2008) Microstructures and Fusing Electrical Current of Microelectronic Sn-9Zn-(0.25RE) Solders. MATERIALS TRANSACTIONS, 49 (7). 1491-1495 doi:10.2320/matertrans.mf200801
Plain TextHung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Lan, Kung-An (2008) Microstructures and Fusing Electrical Current of Microelectronic Sn-9Zn-(0.25RE) Solders. MATERIALS TRANSACTIONS, 49 (7). 1491-1495 doi:10.2320/matertrans.mf200801
In(2008) MATERIALS TRANSACTIONS Vol. 49 (7) Japan Institute of Metals

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Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Chen, Ping-Hui (2008) Influence of Ga addition on Microstructure, Tensile Properties and Surface Oxide Film Characteristics of Microelectronic Sn-9Zn-xGa Solders. MATERIALS TRANSACTIONS, 49 (7). 1496-1502 doi:10.2320/matertrans.mf200802
Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Gu, Zhi-Feng (2008) The Recrystallization of Microelectronic Lead-Free Solders. MATERIALS TRANSACTIONS, 49 (10). 2298-2302 doi:10.2320/matertrans.mra2008048
Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Chan, Cheng-Wei (2007) Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders. MATERIALS TRANSACTIONS, 48 (11). 3014-3020 doi:10.2320/matertrans.mer2007165
Hung, Fei-Yi, Wang, Chih-Jung, Lui, Truan-Sheng, Chen, Li-Hui (2005) Electrical Current Phase Transformation of Sn–9Zn–1Ag Alloy. MATERIALS TRANSACTIONS, 46 (8). 1820-1824 doi:10.2320/matertrans.46.1820
Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, You, Ji-Ge (2006) The Effect of Electrical Current on Tensile Properties and Vibration Characteristics of Sn-9Zn-1Cu Lead-Free Solder. MATERIALS TRANSACTIONS, 47 (12). 2935-2941 doi:10.2320/matertrans.47.2935
Hung, Fei Yi, Lui, Truan Sheng, Chen, Li Hui, Chen, Ping Hui (2007) Microstructures and Mechanical Properties of Sn-9Zn-xGa Alloy. Key Engineering Materials, 345. 85-88 doi:10.4028/www.scientific.net/kem.345-346.85
Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, You, Ji-Ge (2007) Vibration fracture behavior of Sn–9Zn–xCu lead-free solders. Journal of Materials Science, 42. 3865-3873 doi:10.1007/s10853-006-0463-3
Chen, Yen-Ting, Hung, Fei-Yi, Chang, Shoou-Jinn, Lui, Truan-Sheng, Chen, Li-Hui (2012) Microstructural Characteristics of InGaZnO Thin Film Using an Electrical Current Method. MATERIALS TRANSACTIONS, 53 (4). 733-738 doi:10.2320/matertrans.m2011312
Hung, Fei-Yi, Wang, Chih-Jung, Huang, Sung-Min, Chen, Li-Hui, Lui, Truan-Sheng (2006) Thermoelectric characteristics and tensile properties of Sn–9Zn–xAg lead-free solders. Journal of Alloys and Compounds, 420. 193-198 doi:10.1016/j.jallcom.2005.11.011
Hung, Fei-Yi, Chen, Puo-Sheng, Lui, Truan-Sheng, Chen, Li-Hui (2005) Thin Film Characteristics of Sn–3.5Ag–(2.0Cu) Alloy. MATERIALS TRANSACTIONS, 46 (12). 3020-3025 doi:10.2320/matertrans.46.3020
Chen, Kuan-Jen, Hung, Fei-Yi, Lui, Truan-Sheng, Chen, Li-Hui, Qiu, Dai-Wen, Chou, Ta-Lung (2013) Effects of Electrical Current on Microstructure and Interface Properties of Sn–Ag–Cu/Ag Photovoltaic Ribbons. MATERIALS TRANSACTIONS, 54 (7). 1155-1159 doi:10.2320/matertrans.m2013110
 
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