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Cheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test. MATERIALS TRANSACTIONS, 49 (7). 1503-1507 doi:10.2320/matertrans.mf200803

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Reference TypeJournal (article/letter/editorial)
TitleEstimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test
JournalMATERIALS TRANSACTIONS
AuthorsCheng, FangjieAuthor
Nishikawa, HiroshiAuthor
Takemoto, TadashiAuthor
Year2008Volume49
Issue7
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.mf200803Search in ResearchGate
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Mindat Ref. ID7779829Long-form Identifiermindat:1:5:7779829:9
GUID0
Full ReferenceCheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test. MATERIALS TRANSACTIONS, 49 (7). 1503-1507 doi:10.2320/matertrans.mf200803
Plain TextCheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test. MATERIALS TRANSACTIONS, 49 (7). 1503-1507 doi:10.2320/matertrans.mf200803
In(2008) MATERIALS TRANSACTIONS Vol. 49 (7) Japan Institute of Metals

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Cheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co. Journal of Materials Science, 43. 3643-3648 doi:10.1007/s10853-008-2580-7
Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi (2005) Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index. MATERIALS TRANSACTIONS, 46 (11). 2329-2334 doi:10.2320/matertrans.46.2329
Yasuda, Kiyokazu, Shohji, Ikuo, Takemoto, Tadashi (2008) Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index. Materials Science Forum, 580. 221-224 doi:10.4028/www.scientific.net/msf.580-582.221
Gao, Feng, Cheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy. Materials Letters, 62. 2257-2259 doi:10.1016/j.matlet.2007.11.060
Shohji, Ikuo, Osawa, Tsutomu, Matsuki, Takashige, Kariya, Yoshiharu, Yasuda, Kiyokazu, Takemoto, Tadashi (2008) Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders. MATERIALS TRANSACTIONS, 49 (5). 1175-1179 doi:10.2320/matertrans.mbw200705
Nishikawa, Hiroshi, WongPiromsarn, Krit, Abe, Hiroya, Takemoto, Tadashi, Fukuhara, Mikio, Inoue, Akihisa (2009) Solderability of Bulk Metallic Glasses Using Lead-Free Solders. MATERIALS TRANSACTIONS, 50 (6). 1326-1329 doi:10.2320/matertrans.me200824
Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi (2008) Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface. MATERIALS TRANSACTIONS, 49 (7). 1518-1523 doi:10.2320/matertrans.mf200851
Gao, Feng, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation. Materials Science Forum, 580. 209-212 doi:10.4028/www.scientific.net/msf.580-582.209
Takemoto, Tadashi, Miyazaki, Makoto (2001) Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test. MATERIALS TRANSACTIONS, 42 (5). 745-750 doi:10.2320/matertrans.42.745
Takemoto, Tadashi (2008) High Dissolution Rate of Solid Materials in Molten Lead-Free Solders. Materials Science Forum, 580. 205-208 doi:10.4028/www.scientific.net/msf.580-582.205
Takemoto, Tadashi (1999) Evaluation of Solder Alloy Characteristics by a Strain Rate Changing Tensile Test. Materia Japan, 38 (12). 942-946 doi:10.2320/materia.38.942
 
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