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Wei, Xiaofeng, Wang, Richu, Feng, Yan, Zhu, Xuewei, Peng, Chaoqun (2011) Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing process. Rare Metals, 30. 627-632 doi:10.1007/s12598-011-0440-0

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructural evolution of Au-Sn solder prepared by laminate rolling during annealing process
JournalRare Metals
AuthorsWei, XiaofengAuthor
Wang, RichuAuthor
Feng, YanAuthor
Zhu, XueweiAuthor
Peng, ChaoqunAuthor
Year2011 (December)Volume30
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s12598-011-0440-0Search in ResearchGate
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Mindat Ref. ID8049220Long-form Identifiermindat:1:5:8049220:7
GUID0
Full ReferenceWei, Xiaofeng, Wang, Richu, Feng, Yan, Zhu, Xuewei, Peng, Chaoqun (2011) Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing process. Rare Metals, 30. 627-632 doi:10.1007/s12598-011-0440-0
Plain TextWei, Xiaofeng, Wang, Richu, Feng, Yan, Zhu, Xuewei, Peng, Chaoqun (2011) Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing process. Rare Metals, 30. 627-632 doi:10.1007/s12598-011-0440-0
In(2011) Rare Metals Vol. 30. Springer Science and Business Media LLC

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