Shao, Lin, Thompson, Phillip E., Bennett, Joe, Dharmaiahgari, Bhanu P., Trombetta, Len, Wang, Xuemei, Chen, Hui, Seo, Hye-Won, Chen, Quark Y., Liu, Jiarui, Chu, Wei-Kan (2003) Using point-defect engineering to increase stability of highly doped ultrashallow junctions formed by molecular-beam-epitaxy growth. Applied Physics Letters, 83 (14). 2823-2825 doi:10.1063/1.1615685
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Using point-defect engineering to increase stability of highly doped ultrashallow junctions formed by molecular-beam-epitaxy growth | ||
Journal | Applied Physics Letters | ||
Authors | Shao, Lin | Author | |
Thompson, Phillip E. | Author | ||
Bennett, Joe | Author | ||
Dharmaiahgari, Bhanu P. | Author | ||
Trombetta, Len | Author | ||
Wang, Xuemei | Author | ||
Chen, Hui | Author | ||
Seo, Hye-Won | Author | ||
Chen, Quark Y. | Author | ||
Liu, Jiarui | Author | ||
Chu, Wei-Kan | Author | ||
Year | 2003 (October 6) | Volume | 83 |
Issue | 14 | ||
Publisher | AIP Publishing | ||
DOI | doi:10.1063/1.1615685Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 8536478 | Long-form Identifier | mindat:1:5:8536478:7 |
GUID | 0 | ||
Full Reference | Shao, Lin, Thompson, Phillip E., Bennett, Joe, Dharmaiahgari, Bhanu P., Trombetta, Len, Wang, Xuemei, Chen, Hui, Seo, Hye-Won, Chen, Quark Y., Liu, Jiarui, Chu, Wei-Kan (2003) Using point-defect engineering to increase stability of highly doped ultrashallow junctions formed by molecular-beam-epitaxy growth. Applied Physics Letters, 83 (14). 2823-2825 doi:10.1063/1.1615685 | ||
Plain Text | Shao, Lin, Thompson, Phillip E., Bennett, Joe, Dharmaiahgari, Bhanu P., Trombetta, Len, Wang, Xuemei, Chen, Hui, Seo, Hye-Won, Chen, Quark Y., Liu, Jiarui, Chu, Wei-Kan (2003) Using point-defect engineering to increase stability of highly doped ultrashallow junctions formed by molecular-beam-epitaxy growth. Applied Physics Letters, 83 (14). 2823-2825 doi:10.1063/1.1615685 | ||
In | (2003, October) Applied Physics Letters Vol. 83 (14) AIP Publishing |
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