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Yeh, Y. T., Chou, C. K., Hsu, Y. C., Chen, Chih, Tu, K. N. (2005) Threshold current density of electromigration in eutectic SnPb solder. Applied Physics Letters, 86 (20). 203504pp. doi:10.1063/1.1929870

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Reference TypeJournal (article/letter/editorial)
TitleThreshold current density of electromigration in eutectic SnPb solder
JournalApplied Physics Letters
AuthorsYeh, Y. T.Author
Chou, C. K.Author
Hsu, Y. C.Author
Chen, ChihAuthor
Tu, K. N.Author
Year2005 (May 16)Volume86
Issue20
PublisherAIP Publishing
DOIdoi:10.1063/1.1929870Search in ResearchGate
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Mindat Ref. ID8542947Long-form Identifiermindat:1:5:8542947:3
GUID0
Full ReferenceYeh, Y. T., Chou, C. K., Hsu, Y. C., Chen, Chih, Tu, K. N. (2005) Threshold current density of electromigration in eutectic SnPb solder. Applied Physics Letters, 86 (20). 203504pp. doi:10.1063/1.1929870
Plain TextYeh, Y. T., Chou, C. K., Hsu, Y. C., Chen, Chih, Tu, K. N. (2005) Threshold current density of electromigration in eutectic SnPb solder. Applied Physics Letters, 86 (20). 203504pp. doi:10.1063/1.1929870
In(2005, May) Applied Physics Letters Vol. 86 (20) AIP Publishing

See Also

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Huynh, Q. T., Liu, C. Y., Chen, Chih, Tu, K. N. (2001) Electromigration in eutectic SnPb solder lines. Journal of Applied Physics, 89 (8). 4332-4335 doi:10.1063/1.1357459
Liu, C. Y., Chen, Chih, Liao, C. N., Tu, K. N. (1999) Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes. Applied Physics Letters, 75 (1). 58-60 doi:10.1063/1.124276
Hsu, Ying-Chao, Chou, Chung-Kwuang, Liu, P. C., Chen, Chih, Yao, D. J., Chou, T., Tu, K. N. (2005) Electromigration in Pb-free SnAg3.8Cu0.7 solder stripes. Journal of Applied Physics, 98 (3). 33523pp. doi:10.1063/1.1999836
Chou, C. K., Chen, C. A., Liang, S. W., Chen, Chih (2006) Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes. Journal of Applied Physics, 99 (5). 54502pp. doi:10.1063/1.2178392
Wei, C. C., Chen, Chih (2006) Critical length of electromigration for eutectic SnPb solder stripe. Applied Physics Letters, 88 (18). 182105pp. doi:10.1063/1.2200158
Tu, K. N., Yeh, C. C., Liu, C. Y., Chen, Chih (2000) Effect of current crowding on vacancy diffusion and void formation in electromigration. Applied Physics Letters, 76 (8). 988-990 doi:10.1063/1.125915
Lee, T. Y., Tu, K. N., Kuo, S. M., Frear, D. R. (2001) Electromigration of eutectic SnPb solder interconnects for flip chip technology. Journal of Applied Physics, 89 (6). 3189-3194 doi:10.1063/1.1342023
Lee, T. Y., Tu, K. N., Frear, D. R. (2001) Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization. Journal of Applied Physics, 90 (9). 4502-4508 doi:10.1063/1.1400096
Agarwal, R., Ou, Shengquan E., Tu, K. N. (2006) Electromigration and critical product in eutectic SnPb solder lines at 100°C. Journal of Applied Physics, 100 (2). 24909pp. doi:10.1063/1.2216487
Liu, C. Y., Chen, Chih, Tu, K. N. (2000) Electromigration in Sn–Pb solder strips as a function of alloy composition. Journal of Applied Physics, 88 (10). 5703-5709 doi:10.1063/1.1319327
Yeh, Everett C. C., Choi, W. J., Tu, K. N., Elenius, Peter, Balkan, Haluk (2002) Current-crowding-induced electromigration failure in flip chip solder joints. Applied Physics Letters, 80 (4). 580-582 doi:10.1063/1.1432443
 
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