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Agarwal, R., Ou, Shengquan E., Tu, K. N. (2006) Electromigration and critical product in eutectic SnPb solder lines at 100°C. Journal of Applied Physics, 100 (2). 24909pp. doi:10.1063/1.2216487

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Reference TypeJournal (article/letter/editorial)
TitleElectromigration and critical product in eutectic SnPb solder lines at 100°C
JournalJournal of Applied Physics
AuthorsAgarwal, R.Author
Ou, Shengquan E.Author
Tu, K. N.Author
Year2006 (July 15)Volume100
Issue2
PublisherAIP Publishing
DOIdoi:10.1063/1.2216487Search in ResearchGate
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Mindat Ref. ID5142743Long-form Identifiermindat:1:5:5142743:4
GUID0
Full ReferenceAgarwal, R., Ou, Shengquan E., Tu, K. N. (2006) Electromigration and critical product in eutectic SnPb solder lines at 100°C. Journal of Applied Physics, 100 (2). 24909pp. doi:10.1063/1.2216487
Plain TextAgarwal, R., Ou, Shengquan E., Tu, K. N. (2006) Electromigration and critical product in eutectic SnPb solder lines at 100°C. Journal of Applied Physics, 100 (2). 24909pp. doi:10.1063/1.2216487
In(2006, July) Journal of Applied Physics Vol. 100 (2) AIP Publishing

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Huynh, Q. T., Liu, C. Y., Chen, Chih, Tu, K. N. (2001) Electromigration in eutectic SnPb solder lines. Journal of Applied Physics, 89 (8). 4332-4335 doi:10.1063/1.1357459
Wei, C. C., Chen, Chih (2006) Critical length of electromigration for eutectic SnPb solder stripe. Applied Physics Letters, 88 (18). 182105pp. doi:10.1063/1.2200158
Yeh, Y. T., Chou, C. K., Hsu, Y. C., Chen, Chih, Tu, K. N. (2005) Threshold current density of electromigration in eutectic SnPb solder. Applied Physics Letters, 86 (20). 203504pp. doi:10.1063/1.1929870
Huang, Annie T., Tu, K. N., Lai, Yi-Shao (2006) Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints. Journal of Applied Physics, 100 (3). 33512pp. doi:10.1063/1.2227621
Lee, T. Y., Tu, K. N., Frear, D. R. (2001) Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization. Journal of Applied Physics, 90 (9). 4502-4508 doi:10.1063/1.1400096
Lee, T. Y., Tu, K. N., Kuo, S. M., Frear, D. R. (2001) Electromigration of eutectic SnPb solder interconnects for flip chip technology. Journal of Applied Physics, 89 (6). 3189-3194 doi:10.1063/1.1342023
Liu, C. Y., Chen, Chih, Liao, C. N., Tu, K. N. (1999) Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes. Applied Physics Letters, 75 (1). 58-60 doi:10.1063/1.124276
Chou, C. K., Chen, C. A., Liang, S. W., Chen, Chih (2006) Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes. Journal of Applied Physics, 99 (5). 54502pp. doi:10.1063/1.2178392
Yoon, Min-Seung, Lee, Shin-Bok, Kim, Oh-Han, Park, Young-Bae, Joo, Young-Chang (2006) Relationship between edge drift and atomic migration during electromigration of eutectic SnPb lines. Journal of Applied Physics, 100 (3). 33715pp. doi:10.1063/1.2210262
Zhang, Lingyun, Ou, Shengquan, Huang, Joanne, Tu, K. N., Gee, Stephen, Nguyen, Luu (2006) Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints. Applied Physics Letters, 88 (1). 12106pp. doi:10.1063/1.2158702
Kim, P. G., Tu, K. N. (1996) Morphology of wetting reaction of eutectic SnPb solder on Au foils. Journal of Applied Physics, 80 (7). 3822-3827 doi:10.1063/1.363336
 
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