Liu, Sam, Potts, Gregory, Scofield, James D. (2000) Thermal Stability in Vacuum and in Air of Al/Ni/W Based Ohmic Contacts to p-Type SiC. Materials Science Forum, 338. 1021-1024 doi:10.4028/www.scientific.net/msf.338-342.1021
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Thermal Stability in Vacuum and in Air of Al/Ni/W Based Ohmic Contacts to p-Type SiC | ||
Journal | Materials Science Forum | ||
Authors | Liu, Sam | Author | |
Potts, Gregory | Author | ||
Scofield, James D. | Author | ||
Year | 2000 (May) | Volume | 338 |
Publisher | Trans Tech Publications, Ltd. | ||
DOI | doi:10.4028/www.scientific.net/msf.338-342.1021Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 9849574 | Long-form Identifier | mindat:1:5:9849574:0 |
GUID | 0 | ||
Full Reference | Liu, Sam, Potts, Gregory, Scofield, James D. (2000) Thermal Stability in Vacuum and in Air of Al/Ni/W Based Ohmic Contacts to p-Type SiC. Materials Science Forum, 338. 1021-1024 doi:10.4028/www.scientific.net/msf.338-342.1021 | ||
Plain Text | Liu, Sam, Potts, Gregory, Scofield, James D. (2000) Thermal Stability in Vacuum and in Air of Al/Ni/W Based Ohmic Contacts to p-Type SiC. Materials Science Forum, 338. 1021-1024 doi:10.4028/www.scientific.net/msf.338-342.1021 | ||
In | (2000) Materials Science Forum Vol. 338. Trans Tech Publications, Ltd. |
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