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Lim, J.-W, Mimura, K, Isshiki, M (2003) Thickness dependence of resistivity for Cu films deposited by ion beam deposition. Applied Surface Science, 217. 95-99 doi:10.1016/s0169-4332(03)00522-1

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Reference TypeJournal (article/letter/editorial)
TitleThickness dependence of resistivity for Cu films deposited by ion beam deposition
JournalApplied Surface Science
AuthorsLim, J.-WAuthor
Mimura, KAuthor
Isshiki, MAuthor
Year2003 (July)Volume217
PublisherElsevier BV
DOIdoi:10.1016/s0169-4332(03)00522-1Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID9905368Long-form Identifiermindat:1:5:9905368:4
GUID0
Full ReferenceLim, J.-W, Mimura, K, Isshiki, M (2003) Thickness dependence of resistivity for Cu films deposited by ion beam deposition. Applied Surface Science, 217. 95-99 doi:10.1016/s0169-4332(03)00522-1
Plain TextLim, J.-W, Mimura, K, Isshiki, M (2003) Thickness dependence of resistivity for Cu films deposited by ion beam deposition. Applied Surface Science, 217. 95-99 doi:10.1016/s0169-4332(03)00522-1
In(n.d.) Applied Surface Science Vol. 217. Elsevier BV

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Lim, J.-W., Isshiki, M. (2006) Electrical resistivity of Cu films deposited by ion beam deposition: Effects of grain size, impurities, and morphological defect. Journal of Applied Physics, 99 (9). 94909pp. doi:10.1063/1.2194247
Lim, J.-W., Mimura, K., Miyake, K., Yamashita, M., Isshiki, M. (2003) Preparation of high-purity Cu films by non-mass separated ion beam deposition. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 206. 371-376 doi:10.1016/s0168-583x(03)00765-1
Kim, Daeil (2003) Deposition of indium tin oxide films on polycarbonate substrates by direct metal ion beam deposition. Applied Surface Science, 218. 71-78 doi:10.1016/s0169-4332(03)00542-7
Lim, J.-W., Mimura, K., Isshiki, M. (2004) Application of glow discharge mass spectrometry for direct trace impurity analysis in Cu films. Applied Surface Science, 227. 300-305 doi:10.1016/j.apsusc.2003.12.007
Lim, Jae-Won, Mimura, Kouji, Miyake, Kiyoshi, Yamashita, Mutsuo, Isshiki, Minoru (2003) Effect of Substrate Bias Voltage on the Thermal Stability of Cu/Ta/Si Structures Deposited by Ion Beam Deposition. Japanese Journal of Applied Physics, 42. 2780-2785 doi:10.1143/jjap.42.2780
Fu, En-Gang, Zhuang, Da-Ming, Zhang, Gong, Yang, Wei-Fang, Zhao, Ming (2003) Substrate temperature dependence of the properties of ZAO thin films deposited by magnetron sputtering. Applied Surface Science, 217. 88-94 doi:10.1016/s0169-4332(03)00523-3
Xue, Chengshan, Yang, Li, Wang, Cuimei, Zhuang, Huizhao (2003) Growth of GaN nanowires through nitridation Ga2O3 films deposited by electrophoresis. Applied Surface Science, 217. 78-81 doi:10.1016/s0169-4332(03)00502-6
Fang, Te-Hua, Chang, Win-Jin (2003) Effect of freon flow rate on tin oxide thin films deposited by chemical vapor deposition. Applied Surface Science, 220. 175-180 doi:10.1016/s0169-4332(03)00817-1
Iijima, J., Lim, J.-W., Hong, S.-H., Suzuki, S., Mimura, K., Isshiki, M. (2006) Native oxidation of ultra high purity Cu bulk and thin films. Applied Surface Science, 253. 2825-2829 doi:10.1016/j.apsusc.2006.05.063
Sorescu, Monica, Grabias, A, Tarabasanu-Mihaila, D, Diamandescu, L (2003) Bulk versus surface effects in magnetic thin films obtained by pulsed laser deposition. Applied Surface Science, 217. 233-238 doi:10.1016/s0169-4332(03)00536-1
Avrekh, M, Monteiro, O.R, Brown, I.G (2000) Electrical resistivity of vacuum-arc-deposited platinum thin films. Applied Surface Science, 158. 217-222 doi:10.1016/s0169-4332(00)00021-0
 
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