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Cheng, Jie, Huang, Shuo, Li, Yang, Wang, Tongqing, Xie, Lile, Lu, Xinchun (2020) RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis. Applied Surface Science, 506. 144668pp. doi:10.1016/j.apsusc.2019.144668

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Reference TypeJournal (article/letter/editorial)
TitleRE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis
JournalApplied Surface Science
AuthorsCheng, JieAuthor
Huang, ShuoAuthor
Li, YangAuthor
Wang, TongqingAuthor
Xie, LileAuthor
Lu, XinchunAuthor
Year2020 (March)Volume506
PublisherElsevier BV
DOIdoi:10.1016/j.apsusc.2019.144668Search in ResearchGate
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Mindat Ref. ID9940390Long-form Identifiermindat:1:5:9940390:4
GUID0
Full ReferenceCheng, Jie, Huang, Shuo, Li, Yang, Wang, Tongqing, Xie, Lile, Lu, Xinchun (2020) RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis. Applied Surface Science, 506. 144668pp. doi:10.1016/j.apsusc.2019.144668
Plain TextCheng, Jie, Huang, Shuo, Li, Yang, Wang, Tongqing, Xie, Lile, Lu, Xinchun (2020) RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis. Applied Surface Science, 506. 144668pp. doi:10.1016/j.apsusc.2019.144668
In(n.d.) Applied Surface Science Vol. 506. Elsevier BV

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