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Kong, Yong, Shao, Jianqun, Wang, Wenchang, Liu, Qifa, Chen, Zhidong (2009) Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment. Journal of Alloys and Compounds, 477. 328-332 doi:10.1016/j.jallcom.2008.09.074

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Reference TypeJournal (article/letter/editorial)
TitleElectroless Sn–Ni alloy plating with high Sn content free of activation pretreatment
JournalJournal of Alloys and Compounds
AuthorsKong, YongAuthor
Shao, JianqunAuthor
Wang, WenchangAuthor
Liu, QifaAuthor
Chen, ZhidongAuthor
Year2009 (May)Volume477
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2008.09.074Search in ResearchGate
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Mindat Ref. ID11892710Long-form Identifiermindat:1:5:11892710:1
GUID0
Full ReferenceKong, Yong, Shao, Jianqun, Wang, Wenchang, Liu, Qifa, Chen, Zhidong (2009) Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment. Journal of Alloys and Compounds, 477. 328-332 doi:10.1016/j.jallcom.2008.09.074
Plain TextKong, Yong, Shao, Jianqun, Wang, Wenchang, Liu, Qifa, Chen, Zhidong (2009) Electroless Sn–Ni alloy plating with high Sn content free of activation pretreatment. Journal of Alloys and Compounds, 477. 328-332 doi:10.1016/j.jallcom.2008.09.074
In(n.d.) Journal of Alloys and Compounds Vol. 477. Elsevier BV

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