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Liu, Xin, Lu, Guoge, Ji, Zhe, Wei, Fuxiang, Yao, Chuandang, Wang, Jiajian (2022) Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder. Metals, 12 (7) 1196 doi:10.3390/met12071196

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder
JournalMetals
AuthorsLiu, XinAuthor
Lu, GuogeAuthor
Ji, ZheAuthor
Wei, FuxiangAuthor
Yao, ChuandangAuthor
Wang, JiajianAuthor
Year2022 (July 14)Volume12
Issue7
PublisherMDPI AG
DOIdoi:10.3390/met12071196Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID15204035Long-form Identifiermindat:1:5:15204035:4
GUID0
Full ReferenceLiu, Xin, Lu, Guoge, Ji, Zhe, Wei, Fuxiang, Yao, Chuandang, Wang, Jiajian (2022) Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder. Metals, 12 (7) 1196 doi:10.3390/met12071196
Plain TextLiu, Xin, Lu, Guoge, Ji, Zhe, Wei, Fuxiang, Yao, Chuandang, Wang, Jiajian (2022) Effect of Ni-Coated Carbon Nanotubes Additions on the Eutectic Sn-0.7Cu Lead-Free Composite Solder. Metals, 12 (7) 1196 doi:10.3390/met12071196
In(2022, July) Metals Vol. 12 (7) MDPI AG

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Lu, Guoge, Lin, Bo, Gao, Zhan, Li, Yingxin, Wei, Fuxiang (2022) Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders. Metals, 12 (7) 1172 doi:10.3390/met12071172
Han, Pin, Lu, Zhenpo, Zhang, Xuping (2022) Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition. Metals, 12 (10) 1768 doi:10.3390/met12101768
Zhang, Ke Ke, Wang, Yao Li, Fan, Yan Li, Zhao, Guo Ji, Yan, Yan Fu, Zhang, Xin (2010) Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints. Materials Science Forum, 650. 91-96 doi:10.4028/www.scientific.net/msf.650.91
Huang, Hui-zhen, Lu, De, Shuai, Ge-wang, Wei, Xiu-qin (2016) Effects of Phosphorus Addition on the Corrosion Resistance of Sn–0.7Cu Lead-Free Solder Alloy. Transactions of the Indian Institute of Metals, 69. 1537-1543 doi:10.1007/s12666-015-0727-1
Nogita, Kazuhiro (2010) Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 (1). 145-149 doi:10.1016/j.intermet.2009.07.005
Sona, Mrunali, Narayan Prabhu, K. (2015) Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time. Transactions of the Indian Institute of Metals, 68. 1027-1031 doi:10.1007/s12666-015-0640-7
Liu, Lu, Xue, Songbai, Ni, Ruiyang, Zhang, Peng (2022) Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy. Crystals, 12 (7) 924 doi:10.3390/cryst12070924
Panisara Sukhontapatipak, , Phairote Sungkhaphaitoon, (2023) The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder. Physics of Metals and Metallography, 124 (13) 1597-1605 doi:10.1134/s0031918x23600082
Saleh, N A, Ramli, M I I, Mohd Salleh, M A A (2017) Effect of Zinc Additions on Sn-0.7Cu-0.05Ni Lead-Free Solder Alloy. IOP Conference Series: Materials Science and Engineering, 238. 12012pp. doi:10.1088/1757-899x/238/1/012012
Kang, Yubin, Choi, Jin-Ju, Kim, Dae-Guen, Shim, Hyun-Woo (2022) The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction. Metals, 12 (8) 1245 doi:10.3390/met12081245
Wu, Huajie, Li, Xin, Wang, Zhe, Liu, Wei (2022) Effect of TiN on Sulfide Morphology of Non-Quenched and Tempered Steel. Metals, 12 (9) 1402 doi:10.3390/met12091402
 
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