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Khoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Urao, Ryoichi (2004) Microwave Plasma Nitriding of Hollow Tube Inner Wall. MATERIALS TRANSACTIONS, 45 (2). 599-601 doi:10.2320/matertrans.45.599

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Reference TypeJournal (article/letter/editorial)
TitleMicrowave Plasma Nitriding of Hollow Tube Inner Wall
JournalMATERIALS TRANSACTIONS
AuthorsKhoo, KhyoupinAuthor
Takeuchi, ManabuAuthor
Onuki, JinAuthor
Urao, RyoichiAuthor
Year2004Volume45
Issue2
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.599Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777362Long-form Identifiermindat:1:5:7777362:5
GUID0
Full ReferenceKhoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Urao, Ryoichi (2004) Microwave Plasma Nitriding of Hollow Tube Inner Wall. MATERIALS TRANSACTIONS, 45 (2). 599-601 doi:10.2320/matertrans.45.599
Plain TextKhoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Urao, Ryoichi (2004) Microwave Plasma Nitriding of Hollow Tube Inner Wall. MATERIALS TRANSACTIONS, 45 (2). 599-601 doi:10.2320/matertrans.45.599
In(2004) MATERIALS TRANSACTIONS Vol. 45 (2) Japan Institute of Metals

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Khoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Komiyama, Takao (2004) Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding. MATERIALS TRANSACTIONS, 45 (3). 942-946 doi:10.2320/matertrans.45.942
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Nagano, Takahiro, Akahoshi, Haruo, Itabashi, Takeyuki, Saito, Tatuyuki, Khoo, Khyoupin (2006) Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating. MATERIALS TRANSACTIONS, 47 (5). 1417-1419 doi:10.2320/matertrans.47.1417
Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Saito, Tatsuyuki, Ishikawa, Kensuke (2007) Influence of Grain Size Distributions on the Resistivity of 80 nm Wide Cu Interconnects. MATERIALS TRANSACTIONS, 48 (3). 622-624 doi:10.2320/matertrans.48.622
Kurosu, Toshiki, Khoo, Khyoupin, Nakamura, Yoshihide, Ozaki, Keisuke, Ishikawa, Nobuhiro, Onuki, Jin (2012) Reliability Enhancement of Thick Al–Cu Wire Bonds in IGBT Modules Using Al2Cu Precipitates. MATERIALS TRANSACTIONS, 53 (2). 453-456 doi:10.2320/matertrans.m2011277
Iguchi, Manabu, Iguchi, Daisuke, Yoshida, Jin (2004) Prediction of the Occurrence of Swirling Liquid Jet. MATERIALS TRANSACTIONS, 45 (5). 1764-1768 doi:10.2320/matertrans.45.1764
Khoo, Khyoupin, Tashiro, Suguru, Onuki, Jin (2010) Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires. MATERIALS TRANSACTIONS, 51 (7). 1183-1187 doi:10.2320/matertrans.m2009339
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1840-1846 doi:10.2320/matertrans.43.1840
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1887-1890 doi:10.2320/matertrans.43.1887
Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Tashiro, Suguru, Chonan, Yasunori, Akahoshi, Haruo, Haba, Toshio, Tobita, Toshimi, Chiba, Masahiro, Ishikawa, Kensuke (2007) Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction. MATERIALS TRANSACTIONS, 48 (10). 2703-2707 doi:10.2320/matertrans.mra2007611
Kagawa, Tsuyoshi, Iguchi, Manabu (2004) Model Experiment on the Production of Silicon Droplet. MATERIALS TRANSACTIONS, 45 (8). 2703-2711 doi:10.2320/matertrans.45.2703
Terakado, Katsuyoshi, Urao, Ryoichi, Ohmori, Miyajiro (1996) Simultaneous plasma treatment for carburizing and carbonitriding using hollow cathode discharge. Metallurgical and Materials Transactions A, 27 (2). 401-405 doi:10.1007/bf02648417
 
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