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Khoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Komiyama, Takao (2004) Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding. MATERIALS TRANSACTIONS, 45 (3). 942-946 doi:10.2320/matertrans.45.942

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Reference TypeJournal (article/letter/editorial)
TitleImprovement of the Surface Layer of Steel Using Microwave Plasma Nitriding
JournalMATERIALS TRANSACTIONS
AuthorsKhoo, KhyoupinAuthor
Takeuchi, ManabuAuthor
Onuki, JinAuthor
Komiyama, TakaoAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.942Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777416Long-form Identifiermindat:1:5:7777416:5
GUID0
Full ReferenceKhoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Komiyama, Takao (2004) Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding. MATERIALS TRANSACTIONS, 45 (3). 942-946 doi:10.2320/matertrans.45.942
Plain TextKhoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Komiyama, Takao (2004) Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding. MATERIALS TRANSACTIONS, 45 (3). 942-946 doi:10.2320/matertrans.45.942
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Khoo, Khyoupin, Takeuchi, Manabu, Onuki, Jin, Urao, Ryoichi (2004) Microwave Plasma Nitriding of Hollow Tube Inner Wall. MATERIALS TRANSACTIONS, 45 (2). 599-601 doi:10.2320/matertrans.45.599
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Nagano, Takahiro, Akahoshi, Haruo, Itabashi, Takeyuki, Saito, Tatuyuki, Khoo, Khyoupin (2006) Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating. MATERIALS TRANSACTIONS, 47 (5). 1417-1419 doi:10.2320/matertrans.47.1417
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin (2001) Interface Reaction between Solder and Plated Nickel Film. MATERIALS TRANSACTIONS, 42 (4). 697-701 doi:10.2320/matertrans.42.697
Onuki, Jin, Komiyama, Takao, Chonan, Yasunori, Koizumi, Masahiro (2002) High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire. MATERIALS TRANSACTIONS, 43 (8). 2157-2160 doi:10.2320/matertrans.43.2157
Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Saito, Tatsuyuki, Ishikawa, Kensuke (2007) Influence of Grain Size Distributions on the Resistivity of 80 nm Wide Cu Interconnects. MATERIALS TRANSACTIONS, 48 (3). 622-624 doi:10.2320/matertrans.48.622
Onuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, Masayasu (2002) Influence of Soldering Conditions on Void Formation in Large-area Solder Joints. MATERIALS TRANSACTIONS, 43 (7). 1774-1777 doi:10.2320/matertrans.43.1774
Onuki, Jin, Chonan, Yasunori, Komiyama, Takao, Nihei, Masayasu, Suwa, Masateru, Kitano, Makoto (2001) Reliability Enhancement of Solder Joints Made by a Void Free Soldering Process. MATERIALS TRANSACTIONS, 42 (5). 890-893 doi:10.2320/matertrans.42.890
Kurosu, Toshiki, Khoo, Khyoupin, Nakamura, Yoshihide, Ozaki, Keisuke, Ishikawa, Nobuhiro, Onuki, Jin (2012) Reliability Enhancement of Thick Al–Cu Wire Bonds in IGBT Modules Using Al2Cu Precipitates. MATERIALS TRANSACTIONS, 53 (2). 453-456 doi:10.2320/matertrans.m2011277
Hikichi, Takayoshi, Komiyama, Takao, Onuki, Jin (2004) New Oxidation Free Steel Wire Annealing Process Using Alcohol-Water Mixing Vapors. Journal of the Japan Institute of Metals, 68 (10). 851-856 doi:10.2320/jinstmet.68.851
Iguchi, Manabu, Iguchi, Daisuke, Yoshida, Jin (2004) Prediction of the Occurrence of Swirling Liquid Jet. MATERIALS TRANSACTIONS, 45 (5). 1764-1768 doi:10.2320/matertrans.45.1764
Khoo, Khyoupin, Tashiro, Suguru, Onuki, Jin (2010) Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires. MATERIALS TRANSACTIONS, 51 (7). 1183-1187 doi:10.2320/matertrans.m2009339
 
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