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Terashima, Shinichi, Tanaka, Masamoto (2004) Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 681-688 doi:10.2320/matertrans.45.681

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Reference TypeJournal (article/letter/editorial)
TitleThermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
JournalMATERIALS TRANSACTIONS
AuthorsTerashima, ShinichiAuthor
Tanaka, MasamotoAuthor
Year2004Volume45
Issue3
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.681Search in ResearchGate
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Mindat Ref. ID7777375Long-form Identifiermindat:1:5:7777375:9
GUID0
Full ReferenceTerashima, Shinichi, Tanaka, Masamoto (2004) Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 681-688 doi:10.2320/matertrans.45.681
Plain TextTerashima, Shinichi, Tanaka, Masamoto (2004) Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 681-688 doi:10.2320/matertrans.45.681
In(2004) MATERIALS TRANSACTIONS Vol. 45 (3) Japan Institute of Metals

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Terashima, Shinichi, Kariya, Yoshiharu, Tanaka, Masamoto (2004) Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition. MATERIALS TRANSACTIONS, 45 (3). 673-680 doi:10.2320/matertrans.45.673
Kariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, Masamoto (2004) Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 689-694 doi:10.2320/matertrans.45.689
Terashima, Shinichi, Takahama, Keiko, Nozaki, Masako, Tanaka, Masamoto (2004) Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder. MATERIALS TRANSACTIONS, 45 (4). 1383-1390 doi:10.2320/matertrans.45.1383
Terashima, Shinichi, Uno, Tomohiro, Hashino, Eiji, Tatsumi, Kohei (2001) Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps. MATERIALS TRANSACTIONS, 42 (5). 803-808 doi:10.2320/matertrans.42.803
Shohji, Ikuo, Mori, Fuminari, Kobayashi, Kojiro F. (2001) Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders. MATERIALS TRANSACTIONS, 42 (5). 790-793 doi:10.2320/matertrans.42.790
Kim, Dae-Gon, Jung, Seung-Boo (2005) Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy. MATERIALS TRANSACTIONS, 46 (6). 1295-1300 doi:10.2320/matertrans.46.1295
Chen, Sinn-wen, Lin, Shih-kang, Jao, Jui-meng (2004) Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints. MATERIALS TRANSACTIONS, 45 (3). 661-665 doi:10.2320/matertrans.45.661
Song, Jenn-Ming, Liu, Nai-Shuo, Lin, Kwang-Lung (2004) Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys. MATERIALS TRANSACTIONS, 45 (3). 776-782 doi:10.2320/matertrans.45.776
Kim, Dae-Gon, Jung, Seung-Boo (2005) Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method. MATERIALS TRANSACTIONS, 46 (11). 2366-2371 doi:10.2320/matertrans.46.2366
Lee, Joonho, Tanaka, Toshihiro, Yamamoto, Masaya, Hara, Shigeta (2004) Effect of Oxygen on Surface Tension of Liquid Ag-Sn Alloys. MATERIALS TRANSACTIONS, 45 (3). 625-629 doi:10.2320/matertrans.45.625
Shohji, Ikuo, Shiratori, Yuji, Yoshida, Hiroshi, Mizukami, Masahiko, Ichida, Akira (2004) Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls. MATERIALS TRANSACTIONS, 45 (3). 754-758 doi:10.2320/matertrans.45.754
 
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