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Terashima, Shinichi, Takahama, Keiko, Nozaki, Masako, Tanaka, Masamoto (2004) Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder. MATERIALS TRANSACTIONS, 45 (4). 1383-1390 doi:10.2320/matertrans.45.1383

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Reference TypeJournal (article/letter/editorial)
TitleRecrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder
JournalMATERIALS TRANSACTIONS
AuthorsTerashima, ShinichiAuthor
Takahama, KeikoAuthor
Nozaki, MasakoAuthor
Tanaka, MasamotoAuthor
Year2004Volume45
Issue4
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.45.1383Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7777488Long-form Identifiermindat:1:5:7777488:2
GUID0
Full ReferenceTerashima, Shinichi, Takahama, Keiko, Nozaki, Masako, Tanaka, Masamoto (2004) Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder. MATERIALS TRANSACTIONS, 45 (4). 1383-1390 doi:10.2320/matertrans.45.1383
Plain TextTerashima, Shinichi, Takahama, Keiko, Nozaki, Masako, Tanaka, Masamoto (2004) Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder. MATERIALS TRANSACTIONS, 45 (4). 1383-1390 doi:10.2320/matertrans.45.1383
In(2004) MATERIALS TRANSACTIONS Vol. 45 (4) Japan Institute of Metals

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Terashima, Shinichi, Tanaka, Masamoto (2004) Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 681-688 doi:10.2320/matertrans.45.681
Terashima, Shinichi, Kariya, Yoshiharu, Tanaka, Masamoto (2004) Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition. MATERIALS TRANSACTIONS, 45 (3). 673-680 doi:10.2320/matertrans.45.673
Kariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, Masamoto (2004) Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects. MATERIALS TRANSACTIONS, 45 (3). 689-694 doi:10.2320/matertrans.45.689
Lee, Jaesik, Bang, Woongho, Jung, Jaepil, Oh, Kyuhwan (2004) Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy. MATERIALS TRANSACTIONS, 45 (3). 783-789 doi:10.2320/matertrans.45.783
Vianco, Paul, Rejent, Jerome, Grant, Richard (2004) Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys. MATERIALS TRANSACTIONS, 45 (3). 765-775 doi:10.2320/matertrans.45.765
Hwang, Chi-Won, Suganuma, Katsuaki (2004) Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni. MATERIALS TRANSACTIONS, 45 (3). 714-720 doi:10.2320/matertrans.45.714
Terashima, Shinichi, Ishikawa, Shinji (2015) Effect of Dispersoids in β-Sn Matrix on Creep Properties of Chip Scale Packages Joined by Sn-xAg-0.5 mass%Cu (x = 1, 2, 3 and 4 mass%) Solder Alloys. MATERIALS TRANSACTIONS, 56 (4). 507-512 doi:10.2320/matertrans.mbw201406
Yamaguchi, Atsushi, Yamashita, Yuhei, Furusawa, Akio, Nishida, Kazuto, Hojo, Takashi, Sogo, Yosuke, Miwa, Ayako, Hirose, Akio, Kobayashi, Kojiro F. (2004) Properties of Solder Joints Using Sn-Ag-Bi-In Solder. MATERIALS TRANSACTIONS, 45 (4). 1282-1289 doi:10.2320/matertrans.45.1282
Takao, Hisaaki, Hasegawa, Hideo (2004) Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn-Ag Eutectic Solder. MATERIALS TRANSACTIONS, 45 (3). 747-753 doi:10.2320/matertrans.45.747
Tanaka, Masamoto, Terashima, Shinichi, Sasaki, Tsutomu (2009) Development of High Drop Shock Reliability Pb-free Solder Alloy LF35. Materia Japan, 48 (3). 138-140 doi:10.2320/materia.48.138
Tsai, Ying-Ling, Hwang, Weng-Sing (2004) Pasty Ranges and Latent Heat Release Modes for Sn-9Zn-xAg Lead-free Solder Alloys. MATERIALS TRANSACTIONS, 45 (6). 1949-1957 doi:10.2320/matertrans.45.1949
 
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