Reference Type | Journal (article/letter/editorial) |
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Title | Effects of accelerating voltage and specimen thickness on the spatial resolution of transmission electron backscatter diffraction in Cu |
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Journal | Ultramicroscopy |
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Authors | Shih, Jhih-Wun | Author |
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Kuo, Ka-Wei | Author |
Kuo, Jui-Chao | Author |
Kuo, Tsung-Yuan | Author |
Year | 2017 (June) | Volume | 177 |
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Publisher | Elsevier BV |
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DOI | doi:10.1016/j.ultramic.2017.01.020Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 4910834 | Long-form Identifier | mindat:1:5:4910834:1 |
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GUID | 0 |
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Full Reference | Shih, Jhih-Wun, Kuo, Ka-Wei, Kuo, Jui-Chao, Kuo, Tsung-Yuan (2017) Effects of accelerating voltage and specimen thickness on the spatial resolution of transmission electron backscatter diffraction in Cu. Ultramicroscopy, 177. 43-52 doi:10.1016/j.ultramic.2017.01.020 |
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Plain Text | Shih, Jhih-Wun, Kuo, Ka-Wei, Kuo, Jui-Chao, Kuo, Tsung-Yuan (2017) Effects of accelerating voltage and specimen thickness on the spatial resolution of transmission electron backscatter diffraction in Cu. Ultramicroscopy, 177. 43-52 doi:10.1016/j.ultramic.2017.01.020 |
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In | (2017) Ultramicroscopy Vol. 177. Elsevier BV |
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